MATERIALS

High thermal stress on high aspectt ratio holes
Repair on BGA & CSP (local thermal chock)


FR4 still primary material - Now and Future

High Tg materials (160°C) is recommended:
- More than 8 layers
- High aspectt Ratio (> 7 : 1)
- High I/O components (BGA)

Low Z axis expansion rates:
- Tg slightly lower

Rogers RO 4003:
- Significant experience
- Not a PTFE materials
- Standard process manufacturing
- Can be combined with other substrate

Alternative materials APPE, PPE, PPO (Nelco N4000.13, N6000, Getek, ...):
- Adapted at different range of frequency at the best cost
- Multiple sources

Capacitance:
- EMI reduction
- Elimination of additional capacitors
- BC2000 substrate (Zycon license)
- 50 microns thickness laminate
- Availability in volume production

Resistors:
- Ohmega ply, ...
- Development in progress


Flex board part Polyimide adhesive less, (standart thickness 25 µ and 50µ),
Rigid board part in FR4 / HTG / Polyimide