TECHNOLOGIES

High Frequencies SL / DL / ML  |  Colaminated Pcb  |  Pcb on carrier  |  Triplate  |  Magnetic wall
Hyper insert in Pcb  |  Cavities  |  Components  |  Micro component  |  Antennas


MICRO COMPONENT

Incapsulation of micro-components in the Z-axis
- Assembly of micro-component within the substrate.
- decoupling resistance




Buried components : Ohmega Ply
Resistive laminate