Rigid PCB technologies - Printed circuit board manufacturer

RIGID

HDI BOARD

IPC definitions:
- High Interconnections level
- Large Size
- Thin Dielectrics
- Thin Line and space
- µvias
- Sequential build up
- High aspect Ratio

Production capabilities:
- Full automized exposure machine
( +/- 50µm accuracy)
- High speed spindle drilling machine
- Electroplating line AR >12
- Electrical test equipment full adapted :
Flying Probe ( 14 probes)
High skins ( fixture)

HIGH aspectT RATIO & HIGH DENSITY

High density = BGA large size or fine pitch
aspectt Ratio (Total thickness/ drilled hole diameter) > 10
High count of layers ( >16) with thin dielectrics

Reliability:
more than 1000 VRT (- 55/+125°C)
- Low Cte materials
- Adapted plating line and chemistry
- selective metallic finishes (Niau or Sn)

HDI: ELECTRICAL TEST

4 flying probes Equipment:
Technical Capabilities:
- maximum board size: 610x 460mm
- pitch: down to 0.3 mm
- High speed test: 8 probes

2 double side universal testers:
Technical Capabilities:
- test field size : 487 x 325 mm
- test field grid : double density

Adaptation of fixtures to face high I/O of microBGA and CSP:
- pitch 1mm up to 34x34 pads
- pitch 0.5mm up to 20 x20pads

µVIA TECHNOLOGY

Large Windows Process:
Copper etched before laser drilling, larger than holes diameter
- perfect plating
- same thickness as in PTH
- High level of reliability

Build up:
- Reinforced materials (Low CTE, High Tg, Polyimide, low Dk,…)

Cost effective solution for high density:
- 1 to 3 µvias level
- Buried µvias
- µvias on BVH
- µvias and Seqentiel build up

Industrial solutions available:

Sequential Buld Up and µvia	2+n(BVH)+2	3+nBVH+3 with Cu Core

MICRO-VIAS CHARACTERISTICS

A	Range of microvia drilling diameter (standard)	120/130 µm
B	Minimum microvia pad	300 µm
C	Minimum microvia landing pad	300 µm
D	Minimum drilled PTH and BVH	0.25 mm
E	Minimum Differnece pad / drilled PTH External	0.250 mm
F	Minimum Differnece pad / drilled PTH Internall	0.270 mm
G	Minimum copper thickness in PTH or µvia	25 µm
H	Line width innerlayer Minimum / industrial	80 µm / 80µm
I	Spacing innerlayer Minimum / industrial	80 µm / 100µm
J	Line width outerlayer Minimum / industrial	80 µm / 100µm
K	Spacing outerlayer Minimum / industrial	100 µm /110µm
L	1^st layer microvias dielectric thickness	40 to 150 µm
	aspectt ratio dielectric thickness / hole diameter 1^st µv layer	< 0.6
M	2^nd layer microvias dielectric thickness	40 to 100 µm
	aspectt ratio dielectric thickness / hole diameter 2^nd µv layer	<0.7

SEQUENTIAL BUILD UP

Sequential Lamination:
Several lamination steps ( At less 2 steps or 3 drilling levels )
- Via in pads with multilevel connection
- Via filled by resin

Base materials:
Low CTE preferred to High tg ( 170°C) base material

MIX BUILD UP

Base Material:
Rogers RO 4000 / Low CTE or High Tg

Build Up:
- Sequential, Standard build up
- Wave guide or cavity
- Line adaptation

PLANAR

Coils replaced with PCB:
- high reliability
- Smt components
- integrated solutions

Characteristics:
- High count of layers : 8 to 24
- High copper thickness : 70 to 210 µm
- Plating edges : plating holes
- µvia integration
- Thin dielectrics

Application:
- Automotive
- Telecom
- Industrial

BACK PANEL

Large caracteristics:
- Size: 700 x 500 mm
   with capabilities till 950 x 600 mm
- Thickness:
   conventional 4.5mm
   capabilities to 6mm
- More than 26 layers
   Controlled impedances +/-7%

Capabilities:
Mini dry press fit : aspect ratio : 10
Metallic finishes :
- ENIG
- Immersion Tin
- Immersion silver
- OSP
- HASL ( conventional dimensions)

Applications:
- Telecom
- Industrial

METAL CORE

Heat dissipation in closed environment needs metallic layers inside Pcb:
- Copper
- CuInCu

or outside Pcb:
- Aluminium ouside

An adapted process to guarantee the reliability of holes through the opening in core

CIV
Tunisia

Groupe elvia pcb - Avenue d'Ochsenfurt - 50211 Coutances cedex - FRANCE
Tél : +33 (0)2 33 76 32 00 - Fax : +33 (0)2 33 76 32 49